FusePly® 250 is a new game-changing material technology designed to achieve covalent chemical bonding in adhesive joints of pre-cured composite structures using either conventional co-bonding or secondary bonding processes. Through patented technology, FusePly® 250 is able to bring a new level of reliability to the typical 250°F bonding process by creating a chemically-active surface for bonding, rather than just a mechanically-prepared surface as with traditional peel plies, sanding, or plasma surface treatment. The result is structural performance and dependability of co-cured bonded structures with the convenience and flexibility from using pre-cured composites. FusePly® 250 was designed to be processed and handled just like conventional peel ply surface preparations, allowing for seamless insertion of the technology into a manufacturing shop. The system, supplied in film form with a peel ply fabric, is engineered to offer a clean, fiber-free surface for composite bonding applications. FusePly® 250 is compatible with most commercial epoxy-based prepregs and adhesive systems. FusePly® 250 requires no additional processing steps, such as sanding or solvent wiping prior to bonding.