Posted to News on 27th Aug 2026, 12:30
Thermally conductive, low modulus epoxy meets NASA low outgassing specifications
Master Bond EP55TCFL is a thermally conductive, electrically insulating epoxy system developed for bonding, sealing, coating, and small potting applications.
It meets NASA low outgassing specifications and incorporates a filler with small particle sizes, enabling application in thin bond lines to minimize thermal resistance. The system is 100% reactive, contains no solvents or diluents, and exhibits low shrinkage upon cure.
The material provides a thermal conductivity of 3.2-3.8 W/(m K) and a volume resistivity greater than 1014ohm-cm at 25degC. It features a low tensile modulus of 8,00012,000 psi, an elongation of 10-20%, and a Shore D hardness of 55-65, providing flexibility and thermal cycling capabilities. EP55TCFL is serviceable over a temperature range of -50degC to +125degC and adheres to substrates including metals, composites, ceramics, and many plastics.
EP55TCFL is available as a two part system or as a one part premixed and frozen system. The two part version has a 100:15 mix ratio by weight, a mixed viscosity of 30,000-60,000 cps, and a working life of 2-4 hours for a 100-gram batch at 25degC. It cures with elevated temperature schedules of 4-6 hours at 50-70degC or 3-4 hours at 80-90degC.
Packaging options include 1, 4, and 8 ounce jars for the two part formulation, as well as 3 cc, 5 cc, and 10 cc premixed and frozen syringes.
